Huawei targets 1.4nm chip production by 2031 despite US sanctions
Huawei has announced an ambition to manufacture 1.4-nanometre semiconductors by 2031, aiming to match the capabilities of industry leaders TSMC and Samsung. The announcement comes amid ongoing US trade restrictions that limit access to specialised manufacturing equipment.
Huawei has set a target to manufacture cutting-edge semiconductors by 2031, claiming the company can produce chips with transistor densities that match the 1.4-nanometre processes expected from competitors such as Taiwan Semiconductor Manufacturing Corp (TSMC) and Samsung. The announcement was made by He Tingbo, head of Huawei’s chip department, at a semiconductor symposium in Shanghai.
Tingbo described the proposed manufacturing process as both "feasible and affordable," according to reporting by The Wall Street Journal. The Chinese technology firm stated that its next-generation chips would be capable of competing with industry standards, despite being subject to continually expanding US trade sanctions since 2019. These restrictions have historically hindered Huawei’s ability to access the specialised equipment required to achieve advanced node production levels.
The timeline for Huawei’s ambition places it five years behind its closest rival in this specific metric. TSMC has revealed that its own 1.4nm process is scheduled to enter production in 2028. While Huawei’s 2031 target lags behind TSMC’s schedule, the company suggests that its approach could offer a more cost-effective solution for the market.
Currently, Huawei’s most advanced chip technology is the 7-nanometre processor, which is utilised in the Mate 60 smartphone series. These chips are produced by Semiconductor Manufacturing International Corp (SMIC), which stands as China’s largest semiconductor manufacturer. The gap between Huawei’s current 7nm capabilities and its 2031 1.4nm goal highlights the significant technical hurdles the company faces under existing export controls.
The semiconductor industry remains highly competitive, with TSMC and Samsung leading in advanced node production. Huawei’s claim to match these capabilities by 2031 represents a major strategic objective for the company, aiming to overcome the limitations imposed by international trade policies that have restricted its access to global supply chains for over half a decade.
